| 摘要 |
PURPOSE:To perform an edging test equivalent to the test conducted with a semiconductor element connected and to find any defect in quality of a lead frame independently from a semiconductor element, by connecting power supply terminals to grounding terminals on an insulating film through a metallic thin- film resistor provided on the film. CONSTITUTION:On an insulating film 1, there are provided a multiplicity of common electrode leads 2, power terminal leads 5 and grounding terminal leads 6 closely to each other. The leads 5 are connected to the leads 6 through a metallic thin-film resistor 7 on the film 1. If a voltage is applied without a semiconductor element connected to the lead frame, the resistance 7 serves os a semiconductor element and the pattern on the film 1 is supplied with current equivalent to that observed when the semiconductor element is connected. Thus, an etching test can be performed only with the lead frame, and by this test any defect in quality of the lead frame can be found independently from the semiconductor element. |
