| 摘要 |
PURPOSE: To improve the assembly structure and to position an element within a very small error by inserting the wedge shape member, which has a prescribed shape surface, between the first and second elements and spreading the adhesive, which joins both elements and one of the surfaces of the member, in the adhesive gap. CONSTITUTION: A frame 11 is provided with a first element (a frame part) 11C having an inclined surface 11C1. A wedge shaped member 35 is stuck to the inclined surface by adhesive. A second element (a printed circuit board) 31 is joined to the member 35. Second surface portions 37B and 39B form a gap 61 by the board 31 and the frame part 11C and hardened adhesive exists in the gap 61. The adhesive links the element 31 and 11C to the member 35 and the member 35 itself surely positions a diode 33 at a desired position by first surface parts 37A and 39A on which the elements 31 and 11C are abutted. Thus, the final settled positions of the elements 31 and 11C are insignificantly affected by the shrinking stress caused by the process during the hardening of adhesive. |
