| 摘要 |
PURPOSE:To easily enable to solder even an Al plate in a small piece shape by using an ordinary inexpensive Pb-Sn solder by interposing a Ni paste between the surface of a surface treated Al plate and a Cu paste and using a rosin flux for the Cu paste layer. CONSTITUTION:The Ni paste consisting of a scaly Ni powder, acryl/melamine resin mixture, dispersant, triethanolamine and curing catalyst is coated on a surface treated Al plate 1 and hardened by heating to form a Ni paste layer 2. The Cu paste consisting of a metal Cu powder resol type phenol resin, saturated fatty acid or unsaturated fatty acid or these metallic salts, metal chelate forming agent and a soldering promotor is in succession coated on the Ni paste layer 2 and hardened by heating to form a Cu paste layer 3. A lead wire 5 is soldered to the Cu paste layer 3 by using a rosin flux and a solder layer 4 is formed. |
