发明名称 INTEGRATED CIRCUIT PACKAGE
摘要 PURPOSE:To eliminate crosstalk between input and output signal wires, by arranging shieding surfaces on and under the signal wires, and arranging shielding wires also between the neighboring signal wires. CONSTITUTION:A first ceramic plate 11 has an aperture in the central part, and is laminated via a first shielding surface 6. A shielding wire 2 is arranged between neighboring signal wires 1. A second ceramic plate 12 has the wider aperture in the central part, and thereon a second shielding surface 8 is formed. This plate is laminated on the ceramic plate 11. Through holes 31, 32 connect the shielding surface 6 and the shielding surface 8 to a ground line or a power supply line. A viahole 34 or a viahole 35 connects the shielding surface 6 or the shielding surface 8 to the shielding wire 2. A bonding wire 4 connects the inner peripheral vicinity of the shielding wire 2 to the shielding surface 8. Thereby, crosstalk between input and output signal wires can be eliminated.
申请公布号 JPS645025(A) 申请公布日期 1989.01.10
申请号 JP19870161864 申请日期 1987.06.29
申请人 SUMITOMO ELECTRIC IND LTD 发明人 GOTO TOMOJI;OTSUKA AKIRA
分类号 H01L23/08;H01L21/60 主分类号 H01L23/08
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