THIN-TYPE MOUNTING TYPE SEMICONDUCTOR DEVICE

摘要

PURPOSE: To improve the space factor of parts assembly and reduce the number of parts used by mounting electronic parts on the inside plane of the outer case where the printed circuit is formed. CONSTITUTION: A desired circuit 11 is formed with copper on the insulation layer in the lower part 15 of a stainless steel case. Electronic parts 12 including a flatly packaged IC memory and connector for external connection are mounted and soldered on the specified position. A plastic cover 14 is set on the assembled case and fixed with adhesive to obtain a very thin and light integrated memory card.