发明名称 MULTILAYERED COPPER-CLADDED LAMINATE
摘要 PURPOSE:To obtain a multilayered copper-cladded laminate which has a good appearance and excellent humidity and heat resistances by using a prepreg comprised of an unwoven glass fabric impregnated with a resin for the inner- layer board side, thereby preventing the resin crack. CONSTITUTION:On the inner-layer board 11 side having inner-and outer-layer copper foils 10, 14, a prepreg 12 is placed which is comprised of an unwoven fabric 12a impregnated with a epoxy resin 12b. With this, the resin crack can be prevented, and a multilayered copper-cladded laminate can be obtained which is excellent in the appearance, and humidity and heat resistances. The deposition amount of the resin is 60-80wt.%. If less than 60%, strain cannot be absorbed, and if over 80%, the whole multilayered copper-cladded laminate becomes thick. The gel time of the prepreg is 100-160 seconds. If shorter than 100 seconds, the impregnability is bad, and if over 160 seconds, the resin portion undesirably flows out.
申请公布号 JPS644090(A) 申请公布日期 1989.01.09
申请号 JP19870157516 申请日期 1987.06.26
申请人 TOSHIBA CHEM CORP 发明人 OKUBO KAZUO
分类号 H05K1/05;H05K1/00;H05K3/46 主分类号 H05K1/05
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