| 摘要 |
PURPOSE:To cause a heat-averaging effect over the whole surface of a device and to prevent the destruction due to a surge from being caused by a method wherein two or more bent pieces are arranged at parts where lead terminals to be attached to the device are overlapped with the device and a solder reservoir is formed between the bent pieces of the lead terminals soldered to the device. CONSTITUTION:Lead terminals 13, 14 to be attached to a double-sided electrode 12 of a device 11 are punched from a hoop material composed of Cu or a Cu-related alloy; one pair each of bent pieces 13a, 13b and 14a, 14b which are parallel with tip parts where terminal bodies 13a, 14a are overlapped with the electrode 12 are installed in a protruding manner; the tip parts are formed to be U-shaped. If the lead terminals 13, 14 are attached to the device 11 by a solder dip method, solder reservoirs 15 are produced by a solder bridged between the bent pieces 13b, 13b and between 14b, 14b at the inside of U-shaped parts formed by the terminal bodies 13a, 13a, the pairs of bent pieces 13b, 13b and 14b, 14b. A heatdissipating function is caused nearly over the whole surface of the device 11; a heat-averaging effect for a temperature rise of the device can be caused; it is possible to prevent the device 11 from being destroyed due to the local temperature rise. |
