| 摘要 |
PURPOSE:To obtain thin copper wire suited for bonding wire by constituting with pure Cu containing one or more of specific rare-earth elements (RE) and oxygen respectively by specific contents. CONSTITUTION:Pure copper especially of a purity 99.999% or better containing one or more of Ti, Zr, V, Hf, Cr, Ca, Mg, Y and the rare-earth elements (RE) by 0.05-10ppm in all together with 1-30ppm of oxygen is used. The additive elements has no effect if they are less than 0.05ppm and harmful beyond 10ppm on the other hand as ball becomes harder. Oxygen of below 1ppm has no effect and beyond 30ppm voids are formed in the ball as oxygen reacts with hydrogen in the atmosphere when the ball is formed. In this way, thin wire suited for bonding can be obtained. |
