| 摘要 |
PURPOSE:To obtain the titled composition applicable by low-temperature coating and suitable for the coating of a film capacitor, by compounding a specific mixed epoxy resin with a phenolic novolak resin triphenylphosphine, inorganic powder and ultrafine silica powder at specific ratios. CONSTITUTION:The objective composition is composed of (A) 100pts.wt. of a mixed epoxy resin having a softening point of 60-75 deg.C and composed of 50-70wt.% of a bisphenol A-type epoxy resin having an average molecular weight of 900-1,200, preferably 950-1,100 and 50-30wt.% of a cresol novolak resin (preferably having a softening point of 65-80 deg.C), (B) 5-80pts.wt. (preferably 10-30pts.wt. especially when a moisture-resistance is highly required) of a phenolic novolak resin (preferably having a softening point of 70-100 deg.C) as a hardener, (C) 0.5-5pts.wt. of triphenylphosphine, (D) 60-200pts.wt. of inorganic powder (preferably silica) and (E) 0.01-2pts.wt. of ultrafine silica powder. |
