Apparatus for holding electrical or electronic components during the application of solder

摘要

A carrier for holding SOIC packages during the application of solder to their leads, the carrier including a frame provided with an end plate (17) with mounting lugs (20). On each lug (20) is mounted an upper U-shaped member (1) and a lower U-shaped elongate member (8) with the respective legs (3) and (10) of the members projecting downwardly. The legs (10) are disposed within the legs (3) but extend further and terminate at outwardly turned ends (11). Adjacent assemblies of the members (1) and (8) define a track (T) therebetween for a line of SOIC packages (24) whose leads (26) rest on end portions (11), and which are restricted against upward movement by the ends (4) of legs (3).