| 摘要 |
<p>PURPOSE:To make it possible to discriminate at which position in a wafer and in which wafer a semiconductor chip is formed, by a method wherein either the discrimination mark of the wafer wherein the semiconductor chip is formed or a mark indicating the position of the semiconductor chip in the wafer is provided in the prescribed part of the semiconductor chip. CONSTITUTION:A mask 310 is provided with a pattern-forming part 311 for forming a pattern of an integrated circuit and the like and a discrimination mark forming part 310. The discrimination mark forming part 312 is provided with a pattern for forming at least either one of marks indicating the kind of a wafer 300 and the position on the wafer. By depositing such a mask 310 on the wafer 300 as shown by an arrow in the process of manufacturing the integrated circuit and the like or separately from this process, the discrimination marks can be formed easily on a semiconductor chip.</p> |
