发明名称 MEJORAS A CINTA ADHESIVA DE TRANSFERENCIA ELECTRICA Y TERMICAMENTE CONDUCTORA
摘要 The adhesive layer of the novel transfer tape contains electrically and thermally conductive particles such as silver which are preferably spherical and are larger than the thickness of the adhesive between particles. When used to bond two rigid substrates together, pressure is applied to the substrates to flatten the particles to the thickness of the adhesive between particles, thus making good electrical and thermal connection between the substrates through each particle.
申请公布号 MX158056(A) 申请公布日期 1988.12.29
申请号 MX19840201442 申请日期 1984.05.24
申请人 MINNESOTA MINING AND MANUFACTURING COMPANY 发明人 ROBERT S. REYLEK;KENNETH C. THOMPSON
分类号 C09J7/02;H01L21/301;H01L21/302;H01L21/58;H01L21/683;H01L23/373;H01L23/482;H05K3/32 主分类号 C09J7/02
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