| 摘要 |
A device is described for testing electroplating baths (electrolytes) which serve for metallising printed-circuit boards for electronic appliances. Increasingly, printed-circuit boards are used having holes which are plated through by electroplating. The test methods known hitherto for assessing an electroplating bath do not permit adequate quality assessments for printed-circuit boards of this type. Only improvements of known test devices make it possible, using a test cell having an angular shape, and by means of a suitable arrangement of two anodes, to assess unambiguously the bath quality (electrolyte) even when taking into account the metallised holes in a printed-circuit board. |
