Arrangement and method for separation of the semiconductor chips contained in a wafer whilst maintaining their order

摘要

To separate the semiconductor chips (25) contained in a wafer (22), maintaining the order of the chips (25) on the wafer (22), a method is specified which operates with the aid of an arrangement containing simple rotating parts. The wafer (22) is bonded to an easily stretched adhesive foil (19) stretched onto rings (5, 6) and is scribed along the scribe grids. The water (22) is broken into the individual semiconductor chips (25) which remain bonded to the adhesive foil (19). The adhesive foil (19) is stretched further and extended by pressing in further rings (7, 8). During this process, gaps (26) form between the individual semiconductor chips (25) so that the individual semiconductor chips (25) can be selectively removed by means of an aid, for example extraction tweezers, without damaging the adjacent semiconductor chips (25). <IMAGE>