发明名称 Method of fabricating a tape intended to provide circuits for electronic modules, and tape obtained by this method.
摘要 PCT No. PCT/CH88/00102 Sec. 371 Date Feb. 3, 1988 Sec. 102(e) Date Feb. 3, 1989 PCT Filed Jun. 6, 1988 PCT Pub. No. WO88/10509 PCT Pub. Date Dec. 29, 1988.The invention concerns a method of mass producing a tape intended to provide electrical circuits, the tape constituting an intermediate step in the production of electronic modules. The method comprises providing a metal strip (1) having openings defining a series of similar networks of conductors, each conductors being connected to the strip (1) by a bridge, and providing insulating sheets (18) having holes (19, . . . 27) and sticking these sheets to the metal strip in such a manner that the holes face the conductors. The thus-assembled strip (1) and sheets (18) constitute the tape, while the conductors with a part of the sheets define the circuits of the modules.
申请公布号 EP0296511(A1) 申请公布日期 1988.12.28
申请号 EP19880109743 申请日期 1988.06.18
申请人 ETA SA FABRIQUES D'EBAUCHES 发明人 STAMPFLI, JEAN-MARCEL
分类号 H01L21/60;H01L21/48;H01L23/495;H01L23/498;H01L23/50;H05K1/00;H05K3/00;H05K3/20;H05K3/28;H05K3/38;H05K3/40 主分类号 H01L21/60
代理机构 代理人
主权项
地址