| 摘要 |
<p>Aqueous compositions containing polymeric fat acid polyamide resins are disclosed and their use in coatings and adhesives. The polyamide resins are dispersed or dissolved in aqueous solutions containing alkylaminoalalkanolamines, such as N,N-dimethyl or diethyl ethanolamine in an amount sufficient to form a salt with the acid group of the polyamide resin. The thermoplastic, hot melt, polymeric fat acid polyamides are useful as adhesives in a process of bonding substrates wherein the aqueous solution of the polyamide is applied on a wet film to at least one of the substrates to be bonded, removing the water, heating the polyamide above its melting point and cooling the polyamide after contact of the substrate to be bonded.</p> |
