发明名称 SEMICONDUCTOR SEALING DEVICE
摘要 PURPOSE:To enable to secure a ceramic lid to an accurate position by printing, drying and temporarily hardening in advance an adhesive on a tape, heating it to soften it and transferring it to the bottom surface of the lid. CONSTITUTION:An adhesive printing tape 3 is sequentially fed by suitable feeders 5, 5. A heater 6 for heating and softening the adhesive 4 of the tape is provided in the course of the advancing passage of the tape 3. When the tape 3 passes the vicinity of the heater 5, it is locally heated, and the adhesive 4 is softened. Then, a sealing lid 1 is removed from a lid tray 2, and the bottom is pressed to the adhesive 4. The softened adhesive 4 is transferred to the bottom surface of the lid 1. This lid 1 is placed on a thick film printed substrate 7. Then, the lid 1 is pressed by a clip on the substrate 7. Then, the adhesive 4 is cooled and solidified soon, and the lid 1 is secured to the correct position.
申请公布号 JPS5966153(A) 申请公布日期 1984.04.14
申请号 JP19820177789 申请日期 1982.10.08
申请人 SUMITOMO DENKI KOGYO KK 发明人 TANAKA MASATOSHI
分类号 B65B15/04;H01L21/50;H01L23/02 主分类号 B65B15/04
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