| 摘要 |
PURPOSE:To prevent a drive roller, a reference plate and a head from slippage therebetween by forming tooth forms on the outer peripheries of the reference plate, head and drive roller opposed thereto and fitting a timing belt having large coefficient of friction onto said tooth forms to project slightly therefrom. CONSTITUTION:A semiconductor wafer applied to a reference plate is pressed against an emery cloth on a turn table by lowering a head. Next, a drive roller 10 contacting circumferentially the outer surface of the head and reference plate is rotatably driven relatively above the center of turn table, while grinding agent is supplied to the emery cloth to polish the semiconductor wafer. Then, a roller body 11 in the drive roller 10 is formed on the lower peripheral edge with a tooth form 13 onto which a timing belt 14 made of urethane of the like having large coefficient of friction is fitted with the outer peripheral surface projecting slightly from the outer peripheral surface of roller body 11. As a result, the driven roller 10, reference plate and head are prevented from slippage therebetween. |
