| 摘要 |
PURPOSE:To enable a package to be provided with specified high temperature conductivity and low permittivity by a method wherein a ceramic package is composed of a substrate part mounting semiconductor element etc., with high thermal conductive ceramic conductor wirings and a frame part bonded onto the substrate part comprising low temperature baked ceramics. CONSTITUTION:A low temperature baked ceramic compound such as a borosillicate glass etc., capable of being baked at low temperature below 1400 deg.C is formed on a green sheet 12. Next, a specified conductor wiring pattern 14 is printed with a metallic paste of gold, silver etc., in high electric conductivity on this green sheet 12. Finally this green sheet 12 in single body or laminated body state mounted on a high thermal conductive ceramics 10 comprising aluminium nitride, silicon carbide, beryllium oxide, etc., previously baked at high baking temperature is baked at low temperature below 1400 deg.C to be formed into one body.
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