| 摘要 |
PURPOSE:To minimize a connecting wire in length even when the disposition of a stem terminal varies by a method wherein a chip bonding section is provided at the center of the surface of an insulator sub-mount main body and a wire bonding section is symmetrically disposed for the chip bonding section. CONSTITUTION:A conductive chip bonding section 3, to which an optical semiconductor element chip 1 is bonded, is provided at the center of an insulator sub- mount main body 2 surface and electrode bonding sections 4 and 4 are symmetrcally built at both sides of the chip bonding section 3. The sub-mount main body 2 is attached to a metallic block 6 bonded to a stem (or package) and an upper electrode of the chip 1 is connected with a lead terminal (not shown in figures) with a wire 12 through the intermediary of the electrode bonding section 4. As the electrode bonding sections 4 are provided at both ends of the sub-mount main body 2, the wiring can be performed with the wire 12 minimum in length even though the lead terminal is provided at either side of the metallic block 6.
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