| 摘要 |
PURPOSE:To fuse the solder on the specific element only among the elements bonded on a circuit substrate by a method wherein the solder, with which the circuit substrate and the element are jointed, is fused by heating by the heat conduction of a heater block and the heating by hot air. CONSTITUTION:The entire element is heated by the heat conduction from a heater block 4 which comes in contact with the upper surface of an element 2 and at the same time, the hot air is allowed to flow into the part between the element 2 and a circuit substrate 1 through the hot air paths 5 and 5' provided in the heater block 4. After heating the solder flip chip bonding part of the element 3, said hot air goes up along the shielding wall on the opposite side of the element 2, and discharged to outside. Accordingly, solder can be fused reliably in a short period by both heating by heat conduction of the heater block and the heat of hot air, and the range of hot air flowing on the circuit substrate can be localized.
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