| 摘要 |
PURPOSE:To prevent the damage of a Cu thick-film conductor pattern, to remove agglutination and peeling approximately, to reduce abrasion, to obtain an excellent contact and to obviate heat generation and welding by using a material, in which specific quantities of tin oxide and indium oxide are contained respectively to Ag, as a contact material for a slide contact. CONSTITUTION:Resistance paste is baked onto a ceramic substrate 1 to form a thick-film resistance pattern 2, and a wiring board 4 to which thick-film conductor patterns 3 shaped by baking Cu conductor paste while being connected to the thick-film resistance pattern 2 are form ed is shaped. A slide contact 5 in which a contact material 6 consisting of Ag-3-15wt.% tin oxide-1-10wt.% indium oxide is set up to a spring terminal material 7 is formed so as to be able to be slid opposed to the thick-film conductor patterns 3 for the wiring board 4. The effect of lubrication is reduced and agglutination and peeling are generated when the slide contact is brought into contact with the thick-film conductor patterns in Cu when tin oxide in Ag is less than 5wt.% or indium oxide is less than 1wt.%, and tin oxide or indium oxide causes the generation of noises when tin oxide exceeds 15wt.% or indium oxide 10wt.%.
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