发明名称 PACKAGE DISASSEMBLING APPARATUS
摘要 PURPOSE:To remove a bundled wire by small force smoothly and easily and to perform disassembling without generating a mistake in wire cutting and removing work by mounting a mechanism for detecting the gap of a wire gripping part by a cutter for cutting the wire of a package and a gripper for gripping the cut wire to pull off the same. CONSTITUTION:When a package A arrives at the predetermined position of a turntable 2, the before-and-behind centering to an advance direction is performed. A fixing table 28 rises and the package A is supported in such a state that a wire B is inserted between protruding levers 202 by a wire push-in mechanism 20. When the grasping part consisting of an automatic nipper 23 and a gripper 22 supported by an insulator 87 is brought into contact with the earthed wire push-in mechanism, an electric circuit is constituted and the current or voltage thereof is detected. Or, a sensor 89 is embedded in the grasping part or side of the leading end part of the automatic nipper 23 or gripper 22 and a detection plate 90 is provided on the other wide in opposed relation thereto an open width is measured to confirm the contact of the cutter and the gripper with the wire B.
申请公布号 JPS63317437(A) 申请公布日期 1988.12.26
申请号 JP19870145340 申请日期 1987.06.12
申请人 AIKAWA TEKKO KK;LION ENG KK 发明人 AIKAWA YOSHIHIKO;KANEKO TADASABUROU;KAKUMARU TOSHIO
分类号 B65B69/00 主分类号 B65B69/00
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