发明名称 CUTTING METHOD FOR BASE
摘要 PURPOSE:To protect an end section of base from chipping at the time of cutting a base, and make a post-work of removing cut pieces constituting the base section only at the time of cutting by coating the base with a filling agent, to a carrier and cutting the base together with the carrier and the filling agent or with the filling agent. CONSTITUTION:For example, a pipe-shaped carrier into 1 which, for example, an indeterminate crystal base 2 is inserted, and a space between the carrier 1 and a crystal 2 is filled by pouring a fluidizing filling agent 3 therein, and the crystal 2 is bonded with the carrier 1 by curing said filling agent 3. After being fixed, the crystal 2 is cut together with the carrier 1 and a filling agent by a blade 4 of a cutter. Chipping at the time of cutting can be prevented by fixing the whole periphery of the base 2 with the tilling agent 3. Said fixing can be carried out by pouring in and curing the filling agent 3, and as the base is fixed with a thin bonding layer, a support to be processed in accordance with the base shape can be eliminated. Also, the base 2 is fixed with the whole outer periphery, the filling agent 3 of weak bonding power to be peeled off easily can be selected for use.
申请公布号 JPS63317305(A) 申请公布日期 1988.12.26
申请号 JP19870155157 申请日期 1987.06.22
申请人 SONY CORP 发明人 SATO HIROSHI
分类号 B28D5/02;B28D5/00;B28D7/04 主分类号 B28D5/02
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