发明名称 TARGET FOR SPUTTERING
摘要 PURPOSE:To make the joints in the titled target free from difference in level and to prevent the peeling and cracking of the target during sputtering by setting spacers in the gap between target members and a backing plate. CONSTITUTION:When target members 101 of a Tb-Fe alloy or the like are soldered to a backing plate 104 of Cu or the like, the surfaces of the members 101 to be soldered are metallized with Cu or the like and a sheet of solder 103 contg. In or the like and fine wires of W or the like as spacers are set on the plate 104. The target members 101 are then put and soldered in an inert atmosphere. By this structure, a high quality target hardly causing peeling and cracking and having no difference in level at the joints can be obtd.
申请公布号 JPS63317668(A) 申请公布日期 1988.12.26
申请号 JP19870152019 申请日期 1987.06.18
申请人 SEIKO EPSON CORP 发明人 YAMAGISHI TOSHIHIKO
分类号 H01L21/203;C23C14/34 主分类号 H01L21/203
代理机构 代理人
主权项
地址