| 摘要 |
PURPOSE:To prevent the flux rise through a part lead insertion hole by turning upwards in an erecting state after permeating a flux by dipping a sponge in the flux and pressing it to a printed circuit board by moving upwards after the lapse of specified time. CONSTITUTION:A sponge 1A is located in the flux liquid 29 of a flux tank 4. A sponge holding means 1 is turned to an upper vertical position by a rotation driving means 5 and the flux 29 inside the sponge 1A is descended as the lapse of time. A vertical moving means 12 is driven after preset time, the tip face of the sponge 1A presses the lower end face of a printed board 22 and the flux 29 is coated on the lead tip coating part of a part 23. The flux rise through the part lead insertion hole of the printed board can thus be prevented and the generation of the defective contact point of a contact point part, etc., is prevented.
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