| 摘要 |
PURPOSE:To eliminate the need to form a reference pressure chamber independently outside a sensor chip by using the atmospheric pressure in a cavity area formed in a substrate as a reference pressure. CONSTITUTION:The cavity area 25 held at a prescribed reference pressure is formed airtightly in the Si substrate by the diaphragm area 22 consisting of a thin film 23, an upper thin film 26, and a surface protection film 27 while part of the main surface layer part of the substrate 20 is left. Piezoelectric resistance 28 where impurities of prescribed concentration are injected is formed at a prescribed position of the surface of the upper thin film 26. This piezoelectric resistance 28 is connected to metallic wiring 29 through a hole for contact.
|
