| 摘要 |
PURPOSE:To manufacture a precision circuit pattern easily by fixing the surface of a metal foil, where adhesives are applied after ultraviolet rays are irradiated, to an insulating substrate, by setting a part of adhesives, which has not been hardened, by heating, and by removing an unnecessary part of the metal foil by performing a half-punching in the same form as the circuit pattern so that the insulating substrate part will remain on the metal foil side. CONSTITUTION:Ultraviolet rays are irradiated to the surface of a metal foil where adhesives 2 having ultraviolet setting as well as thermalsetting properties are applied through a positive film 6 having a desired circuit pattern 5 and its irradiation makes a part other than the part corresponding to the circuit pattern 5 of the adhesives 2 take a set. The metal foil 1 irradiated by the ultraviolet rays is affixed so that the surface applied by adhesives comes into contact with an insulating substrate 8 and a heat treatment makes a part of adhesives 2 which is not hardened yet take a set and in addition to its treatment, a half punching process is performed to have a metal foil surface in the same form as the circuit pattern 5 so that a part of the insulating substrate 8 will remain at the metal foil side and then, an unnecessary part of the metal foil is removed out of the side of metal foil 1. As the precision circuit pattern is obtained in this way and its pattern is easily manufactured without having a large scale facility, it is also possible to carry out a small lot and multi- product production.
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