| 摘要 |
<p>PURPOSE:To provide a package having heat dissipating properties as required and still having simple construction, by arranging a heat dissipating pattern and a through hole directly under a surface packaging component packaged on a multilayered printed wiring board mounted in a package. CONSTITUTION:Surface packaging components 40 are packaged on the surface of a multilayered printed wiring board 10, while conductor pins 20 are arranged on the rear face of the board to be connected to another board. A heat dissipating pattern 30 and a heat dissipating through hole 37 are arranged directly under each of the components 40 packaged on the circuit board 10. Solder resist 16 is deposited on the surface except the central pattern 30, while the pattern 30 is connected to a power supply layer on the wiring board 10 through the through hole 37. A package 100 for surface packaging components is constituted by the circuit board 10 and a base printed wiring board 200 is mounted thereon by means of the conductor pins 20. The package 100 is thus allowed to have good heat dissipating properties and still to have simple construction.</p> |
