| 摘要 |
PURPOSE:To obtain a filler for semiconductor-sealing resin which has specified physical properties, can be used in a high filling ratio and, when used as a sealing filler, can give a sealing resin which has low stress and excellent thermal shock resistance. CONSTITUTION:This filler for semiconductor-sealing resin is an inorganic powder having a max. particle diameter <=149mum and a value of a compressibility (V) represented by formula I (wherein P>=0.7 and A>=0.5) <=50. Examples of said inorganic powders include hydroxides, chlorides, sulfates, nitrates, oxides, carbides, organic acid salts, etc. of silicon, titanium, aluminum, calcium, zirconium, magnesium, chromium, etc., and mildly burned or molten products thereof.
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