发明名称 METAL MOLD FOR RESIN SEAL OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent formation of resin at the tip part of a lead frame from a groove, by forming at least one groove parallel to and neighboring the outer peripheral side of a cavity in which resin is injected on the surface of a metal mold. CONSTITUTION:In a metal mold 1, a groove 8 is arranged at the part against which a lead frame 3 abuts. When a resin thin film begin to be formed on the boudary surface between the metal mold 1 clamping the lead frame 3 and a surface 6, the groove 8 is filled with resin 5, and the thin film is interrupted at a position of the groove 8. As the result, unnecessary resin burr can be prevented from generating on the lead frame.
申请公布号 JPS63314841(A) 申请公布日期 1988.12.22
申请号 JP19870151843 申请日期 1987.06.17
申请人 NEC YAMAGATA LTD 发明人 NITO TAKESHI
分类号 B29C45/02;B29C45/14;B29C45/26;B29L31/34;H01L21/56 主分类号 B29C45/02
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