PROCESS FOR PROVIDING AN IMPROVED ELECTROPLATED TAPE AUTOMATED BONDING TAPE AND THE PRODUCT PRODUCED THEREBY

摘要

A flexible tape having a desired metal foil circuit pattern and a process for manufacturing such a tape. The starting tape comprises a non-metallic flexible substrate having a metal foil layer adhered thereto. The foil layer is patterned to form a desired circuit pattern and a pattern comprising bussing means. The foil is electroplated by connection of the electroplating circuitry to the bussing means. Thereafter, the tape is reduced in width by removing the bussing means and the underlying flexible substrate.