| 摘要 |
A process for treating metal comprises applying a positive DC potential to an ionic melt layer disposed on the surface of a liquid metal. The application of this potential provides a plasma phase above the ionic melt layer and induces a flow of electrons from the liquid metal towards the plasma phase. The ionic melt layer is capable of being maintained in a liquid state when it is in contact with the liquid metal. The process can be used either to remove impurities from the liquid metal, to alloy the liquid metal by adding metal compounds in the ionic melt layer, to recover metals from waste, or to perform a combination of these functions. An apparatus for treating liquid metals is also provided. |
