| 摘要 |
PURPOSE:To prevent the formation of air gaps and to obtain reliability and high quality by providing bumps on parts corresponding to the through holes of a semiconductor substrate in a region for mounting the substrate of a vessel, and bonding the bump surface by an adhesive to the hole surface of the substrate. CONSTITUTION:A vessel has bumps 7 on a region to be formed with through holes (viaholes) formed to introduce a surface electrode to a rear surface in a semiconductor substrate. The bumps 7 are formed by sequentially plating Ni, Au on a Cu material, and the region to be attached with the substrate is selectively covered with an AuSn film 8 including the bumps 7. When a semiconductor chip is mounted in the vessel, the through holed of the rear surface of the substrate are fitted to the bumps 7, the AuSn is melted to be draped in a state that the AuSn is heated to its melting point or higher. Then, the substrate 1 can be bonded to the vessel without air gap. |
