| 摘要 |
PURPOSE:To improve moisture resistance by flatly composing a section, with which a glass cap is bonded, in a sealing surface and bonding the glass cap through organic adhesives. CONSTITUTION:A section, to which a glass cap 11 is cemented, in a sealing surface in a package member 11 is constituted flatly as compared with other surfaces of the package member 11, and the glass cap 13 is bonded with the flat sealing surface through organic adhesives 16. Consequently, the wavinoss of the surface of the sealing surface in the package member 11 and the roughness of the surface can be reduced, thus shortening a space between the sealing surface and the glass cap 13. The organic adhesives 16 can be shaped thinly by shortening the space, thus diminishing the moisture permeable sectional area of the organic adhesives 16, then lowering the diffusion coefficient of moisture. That is, the intrusion of moisture into a cavity section 11A from the outside can be minimized through the organic adhesives 16. Accordingly, the moisture resistance of a solid-state image sensing device is improved.
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