| 摘要 |
PURPOSE:To enable a highly reliable interlayer connection of wirings to be established even if the multiple layer wiring structure is miniaturized by coating the title device with an upper layer wiring without exposing it to oxidative atmosphere. CONSTITUTION:After vapor reduction processing by hydrogen or carbon monoxide before forming an upper layer wiring 25 on a lower layer wiring 23, the title device is immediately coated with the upper layer wiring 25 without exposing to oxidative atmosphere. Consequently, the overall contact surface of the lower layer wiring 23 and the upper layer wiring 25 can be used for electric conduction so that, even if the wiring width of the lower layer wirings 23 is narrower than viahole diameter, sufficient contact space may be secured using the sides of the lower layer wirings 23. Through these procedures, the contact resistance can be reduced to enhance the electromigration resistance so that the multilayer interconnection structure may be miniaturized without deteriorating the reliability.
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