| 摘要 |
<p>PURPOSE:To cope with required characteristics even if required characteristics are different according to the occupying position of a semiconductor sealing resin by sequentially implanting resin having different characteristics in a resin sealing step, and forming multilayers of the semiconductor sealing resin. CONSTITUTION:A semiconductor element 2 is secured to an island 3, and charged in a resin sealing metal mold 9 in which a lead frame for completely electrically connecting the element 2 by wirings 4 to inner leads 5 is heated to approx. 180 deg.C. Then, semiconductor sealing resin tablets 14, 13, 12 made of multilayers are sequentially inserted into a pot 11 of part of the mold 9, and pressurized by a plunger 10. Then, the tablets 14, 13, 12 start melting from the sections in contact with the mold 9 heated to approx. 180 deg.C, flow through a runner 15 and a gate 16 to a cavity 17, are eventually completely charged to be formed in a layer state and cured after a predetermined time to be completely formed. Semiconductor sealing resin 18 was formed in 3 layers. However, it may be formed in 2 or more multilayers.</p> |
