| 摘要 |
PURPOSE:To absorb the external force exerted on a driving circuit packaging circuit board and to improve the reliability of a device by connecting a liquid crystal display element and the circuit board by a film substrate mounted with a semiconductor chip and providing bent parts to both ends thereof. CONSTITUTION:The film substrate 4' which is mounted with the semiconductor chip 3 and is formed with the bent parts 4A, 4B respectively on both sides is provided between an input/output terminal 1a of the liquid crystal display element 1 and an input/output terminal 2a of the driving circuit packaging circuit board 2. The input/output terminals 4a, 4b thereof are respectively connected to the terminals 1a, 2a. The stress in a tension direction is, therefore, absorbed by both ends of the substrate 4' even if said stress is exerted on said ends. The reliability of the device against oscillation, impact, temp. test, etc., is thus improved. |
