发明名称 SPUTTERING DEVICE
摘要 PURPOSE:To prevent generation of an abnormal discharge at the boundary between the top of a substrate and a mask and to stabilize plasma by insulating a holder which holds the substrate of a sputtering device and the mask from the earth potential. CONSTITUTION:The substrate 3 disposed to face a target (not shown in the figure) is held together with the mask 7 by the holder 6 in a vacuum vessel 1 in which the earth potential is maintained. A negative voltage is impressed on the magnetic target to generate plasma to sputter the target and to form a thin film on the substrate 3. The holder 6 and vacuum vessel 1 of the above- mentioned sputtering device are fixed in contact with each other via 'Teflon(R)' 15 which is an insulator to insulate the holder 6 and the mask 7 from the earth potential. A substrate cooling system consisting of a cooling water inlet 17 and outlet 18, a radiator 19, a circulation pump 20, etc., is preferably insulated from the earth potential as well. Generation of the abnormal discharge is thereby obviated even if the discharge is executed by large electric power. The film forming speed is thus increased.
申请公布号 JPS63312962(A) 申请公布日期 1988.12.21
申请号 JP19870150651 申请日期 1987.06.17
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MUKAI YUJI;TANAKA HIROYOSHI;TSUDA YOSHIYUKI;SHINTAKU HIDENOBU
分类号 H01L21/203;C23C14/04;C23C14/34 主分类号 H01L21/203
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