发明名称 |
PROCESS FOR AVOIDING BLISTER FORMATION IN ELECTROLESS METALLIZATION OF CERAMIC SUBSTRATES |
摘要 |
<p>A process for avoiding blister formation between a metal layer which is electrolessly deposited on a surface of a ceramic substrate is claimed. The substrate is adhesion promoted with an alkali metal composition containing between 0.35 and 0.9 mole fraction alkali metal compound and water at a temperature equal to or in excess of 140 DEG C and not exceeding 300 DEG C, and preferably 240 DEG C, for a time period between 1 and 200 minutes. Thereafter, the adhesion promoted ceramic surface is rendered receptive to electroless metal deposition and is coated free of blisters using an electroless metal deposition bath with an adherent, metal layer having a thickness greater than 5 mu m.</p> |
申请公布号 |
GB2169005(B) |
申请公布日期 |
1988.12.21 |
申请号 |
GB19850030236 |
申请日期 |
1985.12.09 |
申请人 |
* KOLLMORGEN TECHNOLOGIES CORPORATION |
发明人 |
MICHAEL A * DELUCA;JOHN F * MCCORMACK;PETER J * OLESKE |
分类号 |
C04B41/88;C23C18/18;H05K1/03;H05K3/18;H05K3/38;(IPC1-7):C23C18/18 |
主分类号 |
C04B41/88 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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