MANUFACTURE OF IC CHIP-MOUNTING MULTILAYERED SUBSTRATE

摘要

PURPOSE:To reduce stress to be produced owing to thermal expansion and improve multilayered substrate reliability by a method wherein an IC chip- mounting substrate or portion is constructed by using adhesive sheets made of a specified type of woven or non-woven fabric. CONSTITUTION:An IC chip-mounting multilayered substrate of this design is provided with one or more intermediate layers provided with a hole to house an IC chip and with terminals built on the side walls of the hole for the connection of the IC chip. The mounting substrate is a laminate of metal boards or inorganic material boards equipped with a thermal expansion coefficient not higher than 9X10<-6>cm/cm/ deg.C, bonded by using adhesive sheets based on woven or non-woven totally aromatic polyamide fabric. A layer is protected from separation from others and such defects as swelling are prevented by using this method, which results in a high-reliability multilayered structure.