| 摘要 |
PURPOSE:To enable a packaging process to be accomplished with ease and at a low cost by a method wherein a plurality of semiconductor chips is directly die-bonded to a mount and then wire-bonding and resin-sealing are accomplished. CONSTITUTION:A lead frame contains as its major portions die pads 1 and 2, die pad section suspension leads 3, tie bars 4, and inner leads 5. One or more semiconductor chips are wire-bonded to the die pad sections 1 and 2, respectively. A resin-sealing process follows this process of establishing connection between semiconductor chips directly by wire-bonding. This method dispenses with intermediate circuit pattern constructing materials such as laminates, contributing to the saving of materials and manpower and realizing the economical production of resin-sealed multi-tip packages.
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