发明名称 MANUFACTURE OF FLEXIBLE WIRING BOARD
摘要 PURPOSE:To facilitate forming a thin film flexible printed circuit and improve electrical insulating properties, solder heat-resistant properties, chemical-resistant properties, adhesiveness to a circuit substrate, flexibility, uniformity and protective effect for a conductor circuit by a method wherein the predetermined part of the circuit substrate is covered with an organic insulating film composed of a plasma polymerized film of alicyclic monomer. CONSTITUTION:Circuit substrates 5a and 5b are placed on an anode 12 in a reaction chamber 11 and, after the reaction chamber 11 is evacuated through an exhaust outlet 13, monomer is introduced into the reaction chamber 11 through a monomer introducing inlet 14. In this state, a radio frequency power is applied to a cathode 16 from a radio frequency source 15 to induce a glow discharge and ions, radicals and excitation species are created by the collision of electron to which energy is given by an electric field. The required parts of conductor circuits 4a and 4b are covered with an organic insulating film 6 composed of a plasma polymerized film of the monomer by vapor phase reaction of the created ions, radicals and excitation species to obtain flexible printed circuits 7a and 7b. With this constitution, the thin film flexible printed circuit can be formed and the flexible printed circuit with excellent electrical insulating properties, solder heat resistant properties, chemical resistant properties, adhesiveness to the circuit substrate, flexibility, uniformity and protective effect for the conductor circuit can be obtained.
申请公布号 JPS63311793(A) 申请公布日期 1988.12.20
申请号 JP19870147627 申请日期 1987.06.12
申请人 SUMITOMO ELECTRIC IND LTD 发明人 HARA KOJI
分类号 B32B15/08;H05K3/28 主分类号 B32B15/08
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