| 摘要 |
PURPOSE:To improve the strength, heat resistance and electroconductivity of the titled copper alloy by regulating the componental limit value of Cr, Te, Mg, etc. CONSTITUTION:The copper alloy contg. by weight, 0.05-0.3% Cr, 0.001-0.02% Te, contg. 0.005-0.5% total of one or more kinds among Mg, Sn, Si, In, Zn, Ag and mische metals and consisting substantially of the balance copper with inevitable imputities is prepd. 0.001-0.01% P is furthermore added to the above- mentioned compsn. at need. By such constitution, the titled copper alloy having excellent characteristics of strength, electroconductivity and heat resistance can be obtd. Said alloy is therefore suitable as the material for forming a semiconductor lead frame, etc.
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