发明名称 COMPOSITION PLATING METHOD FOR ORNAMENTATION
摘要 PURPOSE:To obtain a lustrous film having superior corrosion and wear resistance by using a plating bath contg. metal ions and dispersed and suspended fine Al2O3 particles and by making electric current supplied to the bath in the early stage of film formation and immediately before the end of film formation higher than electric current supplied in the middle stage. CONSTITUTION:When a metal or alloy and Al2O3 are simultaneously electrodeposited on a body to be plated with a plating bath contg. metal ions and dispersed and suspended fine Al2O3 particles to form a film, electric current supplied to the plating bath in the early stage of film formation and immediately before the end of film formation is made higher than electric current supplied in the middle stage. The average particle size of the fine Al2O3 particles is regulated to 0.01-1.5mum and the concn. of the dispersed and suspended Al2O3 to 0.5-10g/l. Thus, a film which adheres firmly to the body to be plated is formed.
申请公布号 JPS63310997(A) 申请公布日期 1988.12.19
申请号 JP19870144910 申请日期 1987.06.10
申请人 SEIKO INSTR & ELECTRONICS LTD 发明人 UEKI KOZO
分类号 C25D15/02 主分类号 C25D15/02
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