| 摘要 |
PURPOSE:To prevent short circuits due to dew condensation on a device, by containing a semiconductor device under test in a testing bath, and supplying electric power when the surface temperature of said device approximately agrees with the temperature in the bath. CONSTITUTION:A semiconductor device 9 under test is provided on a live board 8 in a testing bath 2. A surface temperature detecting sensor 17 is attached to the surface of the device 9. A temperature detecting sensor 16 for the inside of the bath is attached in a test chamber 3. A dew preventing umbrella 4 is attached and a cap 1 for the testing bath is closed. Thereafter the temperatures are detected with the sensors 16 and 17. When the temperatures approximately agree, electric power is supplied to the device 9. Then, dew condensation due to the difference in temperatures of the device 9 and the test chamber 3 is not yielded. Therefore short circuit faults due to the dew condensation can be eliminated.
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