| 摘要 |
NEW MATERIAL:A compound shown by formula I (R1-R4 are H, lower alkyl, lower alkoxy, Cl or Br; R5 and R6 are H, methyl, ethyl, trifluoromethyl or trichloromethyl; R6 and R7 are H or methyl; D is 2-24C bifunctional organic group). USE:A raw material for polymer having excellent thermal flexibility resistance. PREPARATION:An ether bond-containing diamine compound {e.g. 2,2'-bis[4-(4- aminophenoxy)phenyl]propane} shown by formula II is reacted with an ethylenic unsaturated dicarboxylic acid anhydride (e.g. maleic anhydride) shown by formula III and an allylbicyclo[2,2,1]hept-5-ene-2,3-dicarboxylic acid anhydride shown by formula IV.
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