SUPPORT PAD OF INTEGRATED ELECTRONIC COMPONENT,申请号JP19880128559-传众专利搜索

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发明名称	SUPPORT PAD OF INTEGRATED ELECTRONIC COMPONENT
摘要
申请公布号	JPS63310151(A)	申请公布日期	1988.12.19
申请号	JP19880128559	申请日期	1988.05.27
申请人	SGS MICROELETTRONICA SPA	发明人	PEETAA RAGU
分类号	H01L21/52;H01L23/495;H01L23/50	主分类号	H01L21/52
代理机构		代理人
主权项
地址

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