发明名称 |
WIRING DRAWING-OUT MECHANISM OF THERMAL RECORDING HEAD |
摘要 |
PURPOSE:To reduce thermal stress applied to a solder-connected part and thereby obtain a highly reliable thermal head by providing slits which are short of reaching a FPC end near a junction and arranging them in the from of belt. CONSTITUTION:A substrate connecting terminal 1a for supplying a signal or electric power is provided on the end of a head substrate with a connection with a substrate conductor 1b. In the meantime, FPC2 connected to a head substrate 1 has a FPC connection terminal 2a at the end with a soldered 3 junction with the substrate connecting terminal 1a. The FPC2 has prearranged wiring with FPC conductor 2b including connection wiring to the FPC connection terminal 2a. On FPC2, slits 2c which are short of reaching the end are provided in the form of belt near the FPC connection terminal 2a. |
申请公布号 |
JPS63309468(A) |
申请公布日期 |
1988.12.16 |
申请号 |
JP19870145123 |
申请日期 |
1987.06.12 |
申请人 |
HITACHI LTD |
发明人 |
NAGATA TATSUYA;WATANABE MICHIHIRO;AOYANAGI MASAHISA;HARA HIDEKAZU |
分类号 |
B41J2/345;B41J2/335;H05K1/00;H05K3/36 |
主分类号 |
B41J2/345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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