| 摘要 |
PURPOSE:To enable easily the replacement of defective chip, by heating a bump formed transferring a conductive low melting point resin on the wiring pattern of a substrate, and the connection terminal of a semiconductor chip, dissolving the low melting point resin in an adhesive agent, hardening the adhesive agent, and performing electric conduction between the connection terminal and a wiring pattern. CONSTITUTION:A film 3 in which conductive particles 4 are dispersed in a low melting point resin such as natural wax and synthetic wax, is put on the wiring pattern of a substrate 1. By heating with a laser beam 5 and the like, the part where a bump is to be formed, the film is melted and transferred, and a bump is formed. Otherwise, by the transferring applying mechanical pressure, as in the case of a dot impact printer, the bump is formed. Next, an adhesive agent 6 is spread on the bump forming part or the semiconductor chip 7, positioning between the bump and a connection terminal of the semiconductor chip 7 is performed, the resin is melted by pressing and heating, conductive particles only are left in the connection part, and the resin is dissolved in the adhesive agent 6, which is made to creep around the particles. Then hardening and fixing are performed. Thereby, the easy removal and the replacement for a new chip are enabled only by heating.
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